Littelfuse SP3006 Series Manual do Utilizador descarregar pdf (Página 3)

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

TVS Diode Arrays (SPA

Diodes)

Revision: July 17, 2013

SP3006 Series

Low Capacitance ESD Protection - SP3006 Series

Product Characteristics

Lead Plating Pre-Plated Frame

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute

Material

Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

Time

Temperature

S(max)

S(min)

time to peak temperature

Preheat

rehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

L to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (min to max) (t

) 60 – 180 secs

Average ramp up rate (Liquidus) Temp

) to peak

3°C/second max

S(max)

to T

- Ramp-up Rate 3°C/second max

Reﬂow

- Temperature (T

) (Liquidus) 217°C

- Temperature (t

) 60 – 150 seconds

Peak Temperature (T

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

Part Numbering System

3006

Series

Number of Channels

02 = 2 channel

Package

X = SOT563

T= Tape & Reel

G= Green

TVS Diode Arrays

(SPA

Diodes)

Part Marking System

Product Series

1=SP3006 series

Assembly Site

(varies)

Number of Channels

(varies)

1 * 2

Ordering Information

Part Number Package Marking Min. Order Qty.

SP3006-02XTG SOT563 1*2 3000

1 2 3 4

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