Littelfuse SPLV2.8_4 Series Manual do Utilizador descarregar pdf (Página 3)

145

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

TVS Diode Arrays (SPA

™

Family of Products)

Revision: March 20, 2012

SPLV2.8-4 Series

SPLV2.8-4

Lightning Surge Protection - SPLV2.8-4 Series

Time

Temperature

S(max)

S(min)

time to peak temperature

PreheatPrehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

L to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (min to max) (t

) 60 – 180 secs

Average ramp up rate (Liquidus) Temp

) to peak

5°C/second max

S(max)

to T

- Ramp-up Rate 5°C/second max

Reﬂow

- Temperature (T

) (Liquidus) 217°C

- Temperature (t

) 60 – 150 seconds

Peak Temperature (T

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

)

20 – 40 seconds

Ramp-down Rate 5°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline

Package SOIC

Pins 8

JEDEC MS-012

Millimetres Inches

Min Max Min Max

A 1.35 1.75 0.053 0.069

A1 0.10 0.25 0.004 0.010

A2 1.25 1.65 0.050 0.065

B 0.31 0.51 0.012 0.020

c 0.17 0.25 0.007 0.010

D 4.80 5.00 0.189 0.197

E 5.80

6.20

0.228

0.244

E1 3.80 4.00 0.150 0.157

e 1.27 BSC 0.050 BSC

L 0.40

1.27

0.016

0.050

Recommended

Soldering Pad Outline

(Reference Only)

Product Characteristics

Lead Plating Matte Tin

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

1 2 3 4

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