Littelfuse SP725 Series Manual do Utilizador descarregar pdf (Página 6)

Speciﬁcations are subject to change without notice.

Revised: 04/24/13

TVS Diode Arrays (SPA

Diodes)

General Purpose ESD Protection - SP725 Series

Part Numbering System Product Characteristics

Ordering Information

Embossed Carrier Tape & Reel Speciﬁcation - SOIC Package

Part Number Temp. Range (ºC) Package Marking Min. Order Qty.

SP725ABG -40 to 105 8 Ld SOIC SP725AB(T)G

1960

SP725ABTG -40 to 105 8 Ld SOIC Tape and Reel SP725AB(T)G

2500

SP 725

Series

Package Type

AB: 8 Leaded SOIC

TG=Tape and Reel

G=Green

TVS Diode Arrays

(SPA

Diodes)

Lead Plating Matte Tin

Lead Material Copper Alloy

Lead Coplanarity 0.004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes:

1. All dimensions are in millimeters.

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4.Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

User Feeding Direction

Pin 1 Location

Symbol

Millimetres Inches

Min Max Min Max

E 1.65 1.85 0.065 0.073

F 5.4 5.6 0.213 0.22

P2 1.95 2.05 0.077 0.081

D 1. 5 1. 6 0.059 0.063

D1 1.50 Min 0.059 Min

P0 3.9 4.1 0.154 0.161

10P0 40.0 ± 0.20 1.574 ± 0.008

W 11. 9 12.1 0.468 0.476

P 7. 9 8.1 0.311 0.319

A0 6.3 6.5 0.248 0.256

B0 5.1 5.3 0.2 0.209

K0 2 2.2 0.079 0.087

t 0.30 ± 0.05 0.012 ± 0.002

Notes:

1. SP725AB(T)G means device marking either SP725ABG or SP725ABTG.

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