Littelfuse SP3011 Series Manual do Utilizador descarregar pdf (Página 4)

Speciﬁcations are subject to change without notice.

Revised: 04/24/13

TVS Diode Arrays (SPA

Diodes)

Low Capacitance ESD Protection - SP3011 Series

Embossed Carrier Tape & Reel Speciﬁcation — µDFN-14

Package Dimensions — µDFN-14 (3.5x1.35x0.5mm)

Symbol Millimeters

A0 1.58 ± 0.10

B0 3.73 ± 0.10

D0 0.60 + 0.05

D1 Ø 0.60 + 0.05

E 1.75 ± 0.10

F 5.50 ± 0.05

K0 0.68 ± 0.10

P0 2.00 ± 0.05

P1 4.00 ± 0.10

P2 4.00 ± 0.10

T 0.28 ± 0.02

W 12.00 + 0.30 /- 0.10

User Feeding Direction

Pin 1 Location

Package

µDFN-14 (3.5x1.35x0.5mm)

JEDEC MO-229

Symbol

Millimeters Inches

Min Nom Max Min Nom Max

A 0.45 0.50 0.55 0.018 0.020 0.022

A1 0.00 0.02 0.05 0.000 0.001 0.002

A2 0.203 Ref 0.008 Ref

b 0.15 0.20 0.25 0.006 0.008 0.012

D 3.40 3.50 3.60 0.134 0.138 0.142

D2 - - - - - -

E 1.25 1.35 1.45 0.050 0.054 0.058

E1 - - - - - -

e 0.500 BSC 0.020 BSC

L 0.25 0.30 0.35 0.010 0.012 0.014

Top View

Bottom View

Side View

PIN 1 Index Area

1 2 3 4

Seating

Plane

Pin 1 Identiﬁcation

Chamfer 0.10X45º

Notes:

1. Dimension and tolerancing comform to ASME Y14.5M-1994.

2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily

exact.

Soldering Pad Layout

Recomended

Symbol

Millimeter

Inches

1 2 3 4

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