Littelfuse SP1008 Series Manual do Utilizador descarregar pdf (Página 4)

Speciﬁcations are subject to change without notice.

Revised: 10/21/13

TVS Diode Arrays (SPA

Diodes)

General Purpose ESD Protection - SP1008 Series

1008

W T

Series

Number of

Channels

Package

W: 0201 Flipchip

T= Tape & Reel

G= Green

–

TVS Diode Arrays

(SPA

Diodes)

0.28

0.30

0.75

0.19

Recommended Solder Pad Footprint

*Sizes in mm

Package Dimensions — 0201 Flip Chip

Symbol

0201 Flipchip

Millimeters Inches

Min Typ Max Min Typ Max

A 0.595 0.620 0.645 0.0234 0.0244 0.0254

B 0.295 0.320 0.345 0.0116 0.0126 0.0136

C 0.245 0.275 0.305 0.0096 0.0108 0.0120

D 0.145 0.150 0.155 0.0057 0.0059 0.0061

E 0.245 0.250 0.255 0.0096 0.0098 0.0100

F 0.245 0.250 0.255 0.0096 0.0098 0.0100

G 0.005 0.010 0.015 0.0002 0.0004 0.0006

Embossed Carrier Tape & Reel Speciﬁcation — 0201 Flipchip

Symbol Millimeters

A0 0.41±0.03

B0 0.70±0.03

D ø 1.50 + 0.10

D1 ø 0.20 ± 0.05

E 1.75±0.10

F 3.50±0.05

K0 0.38±0.03

P0 2.00±0.05

P1 2.00±0.05

P2 4.00±0.10

W 8.00 + 0.30 -0.10

T 0.23±0.02

Ordering Information

Part Number Package Marking Min. Order Qty.

SP1008-01WTG 0201 Flipchip X 10000

Part Numbering System

Part Marking System

1 2 3 4

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