Littelfuse PGB2 0201 Series Manual do Utilizador descarregar pdf (Página 3)

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Speciﬁcations are subject to change without notice.

PULSE-GUARD

ESD Suppressors

Surface Mount Polymeric Electrostatic Discharge Suppressors

Revised: August 24, 2012

PGB2 0201 Series

Environmental Speciﬁcations

Operating Temperature ¡$UP¡$

Biased Humity:

Biased Heat:

¡$3)IPVST

¡$IPVST

Thermal Shock

.*-45%.FUIPE(

¡$UP¡$NJODZDMF

10 cycles

Vibration .*-45%.FUIPE"

Chemical Resistance .*-45%.FUIPE

Solder Leach Resistance and

Terminal Adhesion

*1$&*"+45%

Physical Speciﬁcations

Materials

#PEZ&QPYZ(MBTT4VCTUSBUF

5FSNJOBUJPOT$V/J4O

Device Weight NH

Solderability .*-45%.FUIPE

Soldering

Parameters

8BWFTPMEFS¡$TFDPOETNBYJNVN

3FnPXTPMEFS¡$TFDPOETNBYJNVN

Design Consideration

Because of the fast rise-time of the ESD transient, proper

placement of PULSE-GU

ARD

TVQQSFTTPSTBSFBLFZ

design consideration to achieving optimal ESD suppression.

The devices should be placed on the circuit board as close

to the source of the ESD transient as possible. Install

PULSE-GUARD

TVQQSFTTPSTDPOOFDUFEGSPNTJHOBMEBUB

line to ground) directly behind the connector so that they

are the ﬁrst board-level circuit component encountered by

the ESD transient.

Soldering Parameters

Time

Temperature

S(max)

S(min)

time to peak temperature

Preheat

reheat

Ramp-up

amp-up

Ramp-down

amp-d

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

) ¡$

- Temperature Max (T

s(max)

) ¡$

- Time (min to max) (t

) 60 – 180 seconds

Average ramp up rate (Liquidus Temp

) to peak

¡$TFDPOENBY

S(max)

to T

- Ramp-up Rate ¡$TFDPOENBY

Reﬂow

- Temperature (T

) (Liquidus) ¡$

- Temperature (t

) oTFDPOET

Peak Temperature (T

) ¡$

Time within 5°C of actual peak

Temperature (t

)

oTFDPOET

Ramp-down Rate ¡$TFDPOENBY

Time 25°C to peak Temperature (T

) NJOVUFTNBY

Notes:

- PGB2 Series recommended for reﬂow soldering only

3FDPNNFOEFEQSPmMFCBTFEPO*1$+&%&%+45%$

- For recommended soldering pad layout dimensions,

please refer to Dimensions section of this data sheet

1 2 3 4

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