© 2013 Littelfuse, Inc.
32
Revised: December 16, 2013
Varistor Products
MLE Varistor Series
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLE suppressor is
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLE chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
still necessary to ensure that any further thermal shocks
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
6.
5.
230
5.0 6.0 7. 0
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
Reflow Solder Profile
Wave Solder Profile
Lead–free Re-flow Profile
Figure 9
Figure 10
Figure 11
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