Littelfuse 456 Series Manual do Utilizador Página 3

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© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/19/13
Surface Mount Fuses
NANO
> 456 Series
Operating Temperature -55
O
C to 125
O
C with proper derating
Thermal Shock
MIL-STD-202F, Method 107G,
Test Condition B
(5 cycles -65
O
C to 125
O
C)
Vibration
MIL-STD-202F, Method 201A
(10-55 Hz)
Moisture Sensitivity
Level
Level 1 J-STD-020C
Moisture Resistance
MIL-STD-202F Method 106,
High Humidity (90-98%RH),
Heat (65
O
C)
Salt Spray
MIL-STD-202F, Method 101D,
Test Condition B
Mechanical Shock
MIL-STD-202, Method 213,
Test Condition I (100 G’s peak for 6
milliseconds)
Product Characteristics
Dimensions
Part Numbering System
Packaging
Rating Packaging Option Packaging Specification Quantity Quantity & Packaging Code
20A, 25A, 30A 24 mm Tape and Reel EIA RS-481-2 2500 ER
40A 24 mm Tape and Reel EIA RS-481-2 (IEC 286, part 3) 1500 DR
Materials
Body: Ceramic
Cap: Silver Plated Brass
Product Marking Body: Brand Logo, Current Rating
Insulation Resistance
MIL-STD-202, method 302, Test
Condition A (10,000 ohms, Minimum)
Solderability MIL-STD-202, Method 208
Resistance to
Soldering Heat
MIL-STD-202, Method 210,
Test Condition B (10 sec at 260
O
C)
PCB
Recommendation for
Thermal Management
Min. copper layer thickness = 100µm
Min. copper trace width =20A, 30
10mm (20A, 30A) / 15mm (40A)
Alternate methods of thermal man-
agement may be used. In such cases,
under normal operations, the maxi-
mum temperature of the fuse body
should not exceed 80
O
C in a 25
O
C
environment.
10.10
(.397”)
3.120
(.123”)
12.50
(.492)
4.445
(.175”)
4.445
(.175”)
Recommended Pad Layout
Recommended Pad Layout
2.173
(.086”)
2.79
(.110”)
0.30
(.012”)
3.79
(.149”)
5.72
(.225”)
13.3
(.524”)
5.65
(.222”)
3.120
[.123”]
1.70 typ
(0.067”)
3.25
(.128”)
3.43
(.135”)
12.60
(.496”)
6.10
(.240”)
20 A
20A, 25A, 30A:
40A:
F
40 A
F
0456 020. E R
SERIES
AMP Code
qUANTITY Code
PACKAGING Code
Refer to Electrical
characteristics table
E = 2500 pcs
D = 1500 pcs
R = Tape and Reel
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