
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/31/14
Axial Lead & Cartridge Fuses
5×20 mm > Fast-Acting > 216 Series
Product Characteristics
Operating Temperature –55ºC to +125ºC
Thermal Shock
MIL-STD-202G,Method107G,Test
Condition B: (5 cycles –65
°
C to
+125
°
C)
Vibration MIL-STD-202G,Method201A
Humidity
MIL-STD-202G,Method103B,Test
ConditionA.highRH(95%)and
elevatedtemperature(40
°
C)for240
hours.
Salt Spray
MIL-STD-202G,Method101D,Test
Condition B
Material
Body: Ceramic
Cap:Nickel–platedbrass
Leads:Tin–platedCopper
Filler(160mA-16A):Sand
Terminal Strength
MIL-STD-202G,Method211A,Test
Condition A
Solderability
ReferenceIEC60127Second
Edition 2003-01 Annex A
Product Marking
Cap1:Brandlogo,currentand
voLagerating
Cap2:Agencyapprovalmarkings
Packaging
AvailableinBulk(M=1000pcs/pkg)
oronTape/Reel(MRET1=1000pcs/
reel)
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(DependsonFluxActivationTemperature)
(TypicalIndustryRecommendation)
TemperatureMinimum:
100
° C
TemperatureMaximum:
150
° C
PreheatTime: 60-180 seconds
Solder Pot Temperature:
260
° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Hand-Solder Parameters:
SolderIronTemperature:350°C+/-5°C
HeatingTime:5secondsmax.
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
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