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POLY-FUSE

Resettable PTCs

Speciﬁcations are subject to change without notice.

Revised: 01/17/14

Surface Mount > 0402L Series

Environmental Speciﬁcations

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

+85°C, 1000 hours

-/+10% typical resistance change

Humidity Aging

+85°C, 85% R.H.,100 hours

-/+15% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215

No change

Vibration

MIL–STD–883C, Method 2007.1,

Condition A

No change

Moisture Sensitivity Level Level 1, J–STD–020C

Physical Speciﬁcations

Terminal Material

Solder-Plated Copper

(Solder Material: Matte Tin (Sn))

Lead Solderability

Meets EIA Specication RS186-9E,

ANSI/J-STD-002, Category 3.

Soldering Parameters

Time

Temperature

S(max)

S(min)

time to peak temperature

Preheat

reheat

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

to t

Prole Feature Pb-Free Assembly

Average Ramp-Up Rate (T

S(max)

to T

) 3°C/second max

Pre Heat:

Temperature Min (T

s(min)

)

150°C

Temperature Max (T

s(max)

)

200°C

Time (Min to Max) (t

)

60 – 180 secs

Time Maintained

Above:

Temperature (T

)

217°C

Temperature (t

)

60 – 150 seconds

Peak / Classication Temperature (T

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reow temperature exceeds the recommended prole, devices may not meet the

performance requirements

-- Recommended reow methods: IR, vapor phase oven, hot air oven, N

environment for

lead

-- Recommended maximum paste thickness is 0.25mm (0.010 inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices

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